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All
boards tested on Universal bare board testing machine. Facility to do
double sided simultaneous testing of SMD pads. Testing done at
250V 10ohms (continuity test)
10 megaohms
(isolation
test)
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Copper
plating thickness – minimum 25 microns inside holes.
On line checking equipment –
available.
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Minimum
hole size - 0.3mm (finished).
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Minimum
conductor width – 6 MIL.
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Minimum
gap between conductors – 6 MIL.
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Minimum
pitch of SMD IC – 20 MIL.
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Minimum
SMD pin width – 10 MIL.
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Maximum
board size - 580 X 460 mm.
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Tolerance
on hole diameter –
Upto 0.8 mm - + 0.05 mm.
0.9 to 2 mm – + 0.1mm.
Above 2 mm – + 0.15mm.
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Tolerance
on PCB profile - + 0.2mm.
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CNC
routing and V grooving for panels.