• All boards tested on Universal bare board testing machine. Facility to do double sided simultaneous testing of SMD pads. Testing done at 250V    10ohms (continuity test) 10 megaohms (isolation test) 

  • Copper plating thickness – minimum 25 microns inside holes.
    On line checking equipment – available.

  • Minimum hole size - 0.3mm (finished).

  • Minimum conductor width – 6 MIL.

  • Minimum gap between conductors – 6 MIL.

  • Minimum pitch of SMD IC – 20 MIL.

  • Minimum SMD pin width – 10 MIL.

  • Maximum board size - 580 X 460 mm.

  • Tolerance on hole diameter –
    Upto 0.8 mm - + 0.05 mm.

    0.9 to 2 mm – + 0.1mm.

    Above 2 mm – + 0.15mm.

  • Tolerance on PCB profile - + 0.2mm.

  • CNC routing and V grooving for panels.

Specification followed 

  • IPC-A-600F

  • JSS-52301,52302